| [15] | 1 | { |
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| 2 | "Header": { |
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| 3 | "GenerationSoftware": { |
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| 4 | "Vendor": "KiCad", |
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| 5 | "Application": "Pcbnew", |
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| 6 | "Version": "7.0.2" |
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| 7 | }, |
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| 8 | "CreationDate": "2023-11-13T10:32:36+01:00" |
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| 9 | }, |
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| 10 | "GeneralSpecs": { |
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| 11 | "ProjectId": { |
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| 12 | "Name": "sub-d_terminal", |
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| 13 | "GUID": "7375622d-645f-4746-9572-6d696e616c2e", |
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| 14 | "Revision": "rev?" |
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| 15 | }, |
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| 16 | "Size": { |
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| 17 | "X": 32.0, |
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| 18 | "Y": 34.6 |
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| 19 | }, |
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| 20 | "LayerNumber": 2, |
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| 21 | "BoardThickness": 1.6, |
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| 22 | "Finish": "None" |
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| 23 | }, |
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| 24 | "DesignRules": [ |
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| 25 | { |
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| 26 | "Layers": "Outer", |
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| 27 | "PadToPad": 0.2, |
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| 28 | "PadToTrack": 0.2, |
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| 29 | "TrackToTrack": 0.2, |
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| 30 | "MinLineWidth": 0.6, |
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| 31 | "TrackToRegion": 0.5, |
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| 32 | "RegionToRegion": 0.5 |
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| 33 | } |
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| 34 | ], |
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| 35 | "FilesAttributes": [ |
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| 36 | { |
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| 37 | "Path": "sub-d_terminal-B_Cu.gbr", |
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| 38 | "FileFunction": "Copper,L2,Bot", |
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| 39 | "FilePolarity": "Positive" |
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| 40 | }, |
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| 41 | { |
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| 42 | "Path": "sub-d_terminal-B_Paste.gbr", |
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| 43 | "FileFunction": "SolderPaste,Bot", |
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| 44 | "FilePolarity": "Positive" |
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| 45 | }, |
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| 46 | { |
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| 47 | "Path": "sub-d_terminal-B_Silkscreen.gbr", |
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| 48 | "FileFunction": "Legend,Bot", |
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| 49 | "FilePolarity": "Positive" |
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| 50 | }, |
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| 51 | { |
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| 52 | "Path": "sub-d_terminal-B_Mask.gbr", |
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| 53 | "FileFunction": "SolderMask,Bot", |
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| 54 | "FilePolarity": "Negative" |
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| 55 | }, |
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| 56 | { |
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| 57 | "Path": "sub-d_terminal-Edge_Cuts.gbr", |
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| 58 | "FileFunction": "Profile", |
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| 59 | "FilePolarity": "Positive" |
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| 60 | } |
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| 61 | ], |
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| 62 | "MaterialStackup": [ |
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| 63 | { |
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| 64 | "Type": "Legend", |
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| 65 | "Name": "Top Silk Screen" |
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| 66 | }, |
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| 67 | { |
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| 68 | "Type": "SolderPaste", |
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| 69 | "Name": "Top Solder Paste" |
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| 70 | }, |
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| 71 | { |
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| 72 | "Type": "SolderMask", |
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| 73 | "Thickness": 0.01, |
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| 74 | "Name": "Top Solder Mask" |
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| 75 | }, |
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| 76 | { |
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| 77 | "Type": "Copper", |
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| 78 | "Thickness": 0.035, |
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| 79 | "Name": "F.Cu" |
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| 80 | }, |
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| 81 | { |
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| 82 | "Type": "Dielectric", |
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| 83 | "Thickness": 1.51, |
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| 84 | "Material": "FR4", |
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| 85 | "Name": "F.Cu/B.Cu", |
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| 86 | "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" |
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| 87 | }, |
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| 88 | { |
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| 89 | "Type": "Copper", |
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| 90 | "Thickness": 0.035, |
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| 91 | "Name": "B.Cu" |
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| 92 | }, |
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| 93 | { |
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| 94 | "Type": "SolderMask", |
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| 95 | "Thickness": 0.01, |
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| 96 | "Name": "Bottom Solder Mask" |
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| 97 | }, |
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| 98 | { |
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| 99 | "Type": "SolderPaste", |
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| 100 | "Name": "Bottom Solder Paste" |
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| 101 | }, |
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| 102 | { |
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| 103 | "Type": "Legend", |
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| 104 | "Name": "Bottom Silk Screen" |
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| 105 | } |
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| 106 | ] |
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| 107 | } |
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